Main specifications of the LW405-A LaserWriter

All specifications are indicative and subjected to customisation.

LW405-A LaserWriter model

Standard

Compact

Desktop

(options)

Max work area (mm)

A wide range of mask or substrate sizes can be allocated in the process area of the LaserWriter. A vacuum chuck is used (the chuck surface is usually prepared according to customer specifications). The substrate size can be the same as the  working area or larger.

150x150

(6”x6”)

150x150

(6”x6”)

50x50

(2”x2”)

up to 350x350

Positioning accuracy (µm)

This parameter indicates the absolute positioning error on the whole work area, and has a fundamental role in the possibility of overlapping the features belonging to different masking or process levels. Note that it has no relation with the achievable resolution - i.e. the minimum linewidth.

± 0.1

± 1

± 1

 

XY laser interferometer

with 10 nm resolution

Yes

No

No

 

Minimum linewidth (µm)

The minimum linewidth can be selected by the operator among 1, 2 or 4 mm. Optionally a very low resolution mode can be included (10 mm), for fast patterning of high-density interconnects or microwave circuits.

0.8

0.8

2

 

Exposure wavelength (nm)

The standard wavelength of the writing beam is 405 nm (from a GaN solid state laser). Optional 325 nm wavelength is available (from a He-Cd gas laser) for biochemistry applications.

405

405

405

325, 375, 405&375

Exposure on resist

All standard resist-coated masks (chrome or iron oxide). Besides mask writing, the system is also specially suited for maskless direct patterning on the final substrate (Si, GaAs, InP, microwave/cryogenic/biological substrates, etc.).

Yes

Yes

Yes

-

Exposure on LDW glass

The LW405 can pattern process-less substrates, such as Laser Direct Write (LDW) glass masks (see http://www.canyonmaterials.com/ldw.html ).

Yes

Yes

Yes

-

Exposure energy stabiliser

The exposure level is continuously monitored in order to keep it constant during the whole writing process. For grey-level exposure, a reference level is kept constant.

Yes

Yes

Yes

-

Grey-levels capability

Variable pixel to pixel exposure is also available (grey-level patterning) for the fabrication of diffractive optics, MEMs, etc.

Yes

Yes

Yes

-

Variable resolution

Some processes can take advantage of a reduced planar resolution during a microlithographic step. One typical example is the use of rough surfaces as a substrate (alumina, for instance). In the LaserWriter system the resolution is changed by replacing the beam focusing optics, which takes only a few seconds.

Yes

Yes

Yes

-

Assembled in clean-room

Each optical, mechanical and electronic subsystem is carefully cleaned and sanitised, before being incorporated in a LaserWriter unit. Each unit is assembled and tested in clean-room, in order to minimise the possibility of particle release in the future operating environment.

Yes

Yes

Yes

-

Use as substrate inspection station

Each system includes a CCD camera and related illumination system. This allows the operator to use the LaserWriter as a surface inspection and metrology system. A high resolution digital camera and related live image capture and processing system is included.

Yes

Yes

Yes

-

Laser focusing

The LaserWriter includes a full automatic focus track system. This is capable to dynamically keep the laser beam focused on the substrate even if this is slightly concave, convex or tilted.

Auto

Auto

Manual

-

Writing on non-planar samples

This option allows microlithographic operations to be performed on samples with poor planarity or slightly concave or convex substrate.

Yes

Yes

No

-

Writing on tilted samples

Patterning can be made also on slightly tilted samples (up to 2°). This is useful in a R&D environment, if small samples are used after being glued to a larger holder. Although the samples are still planar, the uneven glue layer can affect their orthogonality with the laser beam. In such case the operator can easily instruct the machine to follow the substrate plane during the writing process.

Yes

Yes

No

-

Alignment on marks

If a maskless process has been selected, all different microlithographic processes are performed on the same work sample. In order to properly align to each other the patterns of different layers, a specific procedure is included in the LaserDraw software package. Each new patterning level is drawn aligned with the reference patterns already on the sample.

Yes

Yes

Yes

-

Selectable full manual control

Full manual control mode is useful when the system is used as an inspection and metrology station, and for manual trimming or photoprocessing.

Yes

Yes

Yes

-

CIF, DXF, GDSII data formats

The LaserWriter is driven by a MICROTECH proprietary data format - LDF, LaserDraw Format - obtained by automatic translation from a number of industry standard languages accepted by the LaserWriter, such as CIF, DXF, GDSII.

Yes

Yes

Yes

-

Raster writing mode

The standard patterning strategy is based on raster scanning, that is a combined beam-substrate movement (beam-scan mode or stage-scan mode).

Yes

Yes

Yes

-

Vector writing mode

Pure vector patterning can be selected for specific applications.

Yes

Yes

Yes

-

Floor vibration isolation

The system can be supplied ready for floor installation. A passive vibration isolation leg frame is provided as standard. Active vibration isolation is optionally available, typically for desktop installation.

Yes

Yes

No

Active

Operator training time (hours)

A specific training for the personnel responsible of LaserWriter operation is provided, under direct supervision of MICROTECH engineers.

6

6

6

-

Course on laser lithography (hours)

For all systems, a specialised course on standard and laser microlithography is provided. The course is held directly at the customer's site, soon after system installation and testing.

Yes

Yes

Yes

-
Safety interlocks & CE marking

Both local and remote emergency stop buttons and interlocks are provided. All system components fulfil international regulations and carry the CE marking for safe operation and electromagnetic compatibility.

Yes

Yes

Yes

-